Our CMP Technology
A Plug and Play Design
Commercial Reactive Pad
and Functional Fluid System
A CMP Technology Platform for a Variety
of Materials
Modular Design Offers Scalability
and Business Continuity
Designed for Scale and Supply Continuity
3 Pillars of Our
Technology Platform
01
Abrasive Free Functional Fluids
High selectivity and tunability with benign formulations
02
Chakra™ Functional Pads
Reactive pads and regenerative technology allowing for repeated polishes, requiring no conditioning
03
Proprietary Manufacturing Technology
Single pad manufacturing with in-situ grooving and extensible varied functional chemistry
3 Pillars of Our
Technology Platform
01
Abrasive Free Functional Fluids
High selectivity and tunability with benign formulations
02
Chakra™ Functional Pads
Reactive pads and regenerative technology allowing for repeated polishes, requiring no conditioning
03
Proprietary Manufacturing Technology
Single pad manufacturing with in-situ grooving and extensible varied functional chemistry
Pad Manufacturing
at Scale
Fully Owned Pad Manufacturing in the US
High quality achieved with single pad manufacturing and in-situ grooving
Cleanroom packaging and 100% QC offers product traceability
Currently 60TPY or 5000 pads per month, scalable to 120TPY
Sampling-ready for qualified customers
Pad Manufacturing
at Scale
Fully Owned Pad Manufacturing in the US
High quality achieved with single pad manufacturing and in-situ grooving
Cleanroom packaging and 100% QC offers product traceability
Currently 60TPY or 5000 pads per month, scalable to 120TPY
Sampling-ready for qualified customers
With no abrasives, a purpose-built planarization technology that seamlessly integrates into the existing CMP (chemical mechanical planarization) systems — ChEmpower is positioned strong to replace the existing slurries and the pads with its products.
As co-founder CTO Prof Babu puts it, ‘designing the right chemistry for the formulary polish solution together with the chemical moieties built into the polymer backbone of the planarizing pad are key to achieve the material removal rates and superior planarization’.
Co-founder, CEO Dr. Misra adds, ‘the engineering behind the stitching of these chemical moieties and the tailoring of their densities and combinations, is what constitutes a technology platform that is scalable and extendable to new materials in the technology roadmap for advanced semiconductors’.