Pioneering a sustainable abrasive-free planarization for advanced chip manufacturing
HIGH YIELDS
Abrasive-Free solution engineered to minimize defects and improve yield
MAXIMUM PRODUCTIVITY
Plug and Play CMP materials with improved lifetime
Integrated planarization technology with no abrasives lowers cost of ownership
LOW COST OF OWNERSHIP
Benign chemistry coupled with abrasive-free planarization makes metal recovery and water recycle possible
SUSTAINABILITY
LOW COST OF OWNERSHIP
HIGH YIELDS
MAXIMUM PRODUCTIVITY
SUSTAINABILITY
