In The News
ChEmpower Participates in ICPT 2026 in Korea:
One October 21, 2026 ChEmpower presented its abrasive-free CMP technology at the International Conference on Planarization Technology (ICPT’s) Poster Session. It was an opportunity to explain how the technology works to eliminate particle scratching defects, reduce cost of ownership to end users, and enable an ecologically sustainable water recycling and copper reclaiming. The information was well received with a high level of interest from all top tier-1 semiconductor customers from around the globe that attended the event.
Events and Articles
Toyota Tsusho Corporation announced that it has invested in ChEmpower Corporation
ChEmpower debuts polishing technology to advance semiconductor manufacturing process
Veera Dandu Joins ChEmpower Corporation
ChEmpower Corporation Appoints Sean D. Doyle and Matthew Prince to Board of Directors
ChEmpower Introduces Chakra™, the Industry’s First Functional Pad for Abrasive-Free Planarization
ChEmpower raises $18.7M to advance semiconductor chip polishing technology