Chakra™ Copper Series
Proprietary functional polishing pads for abrasive-free Chemical Mechanical Planarization (CMP)
Selectivity Where CMP Matters Most
Plug-and-play with existing CMP platforms
Sampling-ready with qualified customers
Key Benefits of Chakra™ and Abrasive-Free Planarization
Precision & Selectivity:
Enables controlled material removal and precise stopping on barrier and dielectric layers, supporting dense interconnects and hybrid bonding
Precision &
Selectivity:
Enables controlled material removal and precise stopping on barrier and dielectric layers, supporting dense interconnects and hybrid bonding
Yield & Quality:
Eliminates particle-induced
defects and improves surface quality
Lower Cost & Higher Uptime:
Extends pad life, reduces abrasive-induced tool wear, simplifies and improves process stability in high-volume manufacturing
Yield &
Quality:
Eliminates particle-induced
defects and improves surface quality
Sustainability &
Recycling:
Eliminates abrasive waste and supports water and metal reclamation through environmentally benign particle-free formulations
Lower Cost &
Higher Uptime:
Extends pad life, reduces abrasive-induced tool wear, simplifies and improves process stability in high-volume manufacturing
Sustainability & Recycling:
Eliminates abrasive waste and supports water and metal reclamation through environmentally benign particle-free formulations